Powerchip showcases 3D DRAM stacking for AI bandwidth constraints

Powerchip is using COMPUTEX 2026 to present a 3D AI Foundry concept that includes wafer-on-wafer DRAM stacking, interposers, and integrated passive devices. The pitch combines logic and memory process capabilities for AI chips that need more bandwidth and better energy efficiency. The RamTrend signal is that more foundry and packaging players are targeting memory-adjacent bottlenecks in AI systems. This does not indicate commodity DRAM capacity or near-term pricing, but it shows how demand for AI bandwidth is pulling DRAM packaging and integration into higher-value design flows.