Huawei Uses NAND Packaging Workaround For 122TB SSD

The reported design is a storage-density signal rather than a conventional NAND node announcement. Instead of relying on the most advanced high-layer 3D NAND, Huawei is said to use die-on-board assembly to fit more NAND into the SSD footprint. That matters because packaging innovation can partially offset restrictions on the highest-density flash chips and still enable very large SSD capacities. For the NAND market, the implication is mixed: this kind of engineering could sustain Chinese enterprise-storage capacity even under technology constraints, but it does not necessarily mean lower NAND cost or broad volume availability.