Nan Ya PCB targets AI substrate growth as high-end hardware demand rises

DigiTimes reports that Nan Ya PCB plans to use parent-group factories in southern Taiwan as part of its 2026 development plans. The company is positioning for AI-related demand and higher requirements in automotive and mobile markets. The memory link is indirect but relevant to AI hardware supply. Advanced substrates are part of the packaging chain for high-performance processors and accelerators that often sit alongside HBM and high-capacity memory systems. Extra substrate capacity can support system buildouts, while substrate tightness can constrain AI hardware availability. The item does not provide memory pricing or allocation data. It is best read as an upstream capacity signal for AI infrastructure.