Optical interconnect push shows AI servers are running into bandwidth limits

The article focuses on optical interconnects, co-packaged optics, and the laser supply chain rather than memory devices. Its relevance to RamTrend is the same system-level pressure that is lifting demand for HBM and high-performance storage: AI clusters need much more bandwidth across the whole data path. The piece says AI data centers already represent a large share of laser demand and are expected to drive further market growth through 2030. As scale-up and scale-out links move from copper toward optical approaches, memory, accelerator, and networking roadmaps become more tightly connected. There is no near-term DRAM or NAND price signal here. The article is useful as AI infrastructure context because interconnect bottlenecks can shape server architecture and memory attachment choices.