SEMI data shows materials demand rising with advanced memory production

EE Times Asia reports SEMI's estimate that materials revenue rose 6.8% in 2025 to $73.2 billion. The growth was tied to both wafer fabrication and packaging materials, with high-performance computing and HBM manufacturing named among the demand drivers. This is relevant for memory because HBM and other advanced products require more demanding process flows than commodity memory generations. More process steps and advanced packaging can lift demand for photomasks, resists, chemicals, substrates, and related consumables. The data is an upstream cost and capacity signal, not a direct RAM-price update. It supports the view that AI memory growth is pulling more value into the materials and packaging supply chain.