Samsung foundry recovery gets a lift from AI chips and HBM4

The item is relevant to RamTrend because it links HBM4 demand with Samsung's broader AI semiconductor recovery. While the article is partly about foundry utilization rather than memory sales alone, HBM4 packaging and controller ecosystems can pull demand across advanced process, packaging, and memory manufacturing. The payload does not give shipment or pricing figures, but it supports the view that HBM4 is becoming a meaningful driver in Samsung's AI supply chain.