CoWoS tightness reportedly pushes SK hynix toward Intel packaging option

The report says the industry is looking to diversify the advanced packaging supply chain as AI accelerator demand stretches TSMC's CoWoS capacity. For SK hynix, additional 2.5D packaging options could matter because packaging availability is increasingly tied to how quickly AI memory and accelerator platforms can move through the supply chain. The available summary does not provide volumes, timing or product names. The practical signal is that packaging bottlenecks remain a constraint around AI systems, and memory suppliers are exploring alternatives to reduce dependence on a single packaging channel.