TetraMem sends a 12nm resistive-memory AI chip design to fabrication

TetraMem has completed the tape-out of its MLX300, a 12nm system-on-chip that uses multi-level resistive RAM for analog in-memory computing. EE Times Asia says the design targets audio, vision, and language tasks, with energy efficiency as a goal. Tape-out marks a manufacturing milestone; the supplied report does not include measured performance, production timing, or commercial availability.