TrendForce Flags AI Bottlenecks Across CoWoS, HBM, SSDs and 3nm Supply

According to EE Times Asia, TrendForce sees AI demand creating bottlenecks in 3nm to 2nm wafers and 2.5D/3D advanced packaging. NVIDIA is described as having moved early to secure 4nm and 3nm wafer capacity, CoWoS packaging, substrates, PCBs, HBM and SSDs, while other large technology buyers face delays in obtaining critical components. The report says CoWoS has remained tight since 2023 and expects global 2.5D packaging shortages to ease only slightly by 2027 as TSMC expands capacity. For RamTrend, the memory-relevant point is that HBM and SSD availability is being pulled into a broader AI infrastructure capacity race, reinforcing tight supply conditions beyond DRAM itself.