Samsung to redirect 4nm capacity toward HBM base-die production

A DIGITIMES report says Samsung Electronics plans to manufacture its M2800 mobile modem on a 2nm process rather than 4nm. The move is expected to free 4nm capacity primarily for HBM base dies, the control layer at the bottom of stacked memory products. The report gives no capacity figures or expected output, so the scale of any additional HBM supply is not yet clear.