SK hynix builds inspection capabilities for 3D DRAM and stacked NAND

SK hynix is strengthening its metrology and inspection work as memory structures become more three-dimensional. The source identifies both 3D DRAM architectures and increasingly complex NAND stacking as cases where conventional inspection methods face new demands. It does not specify new tools, investment levels or production milestones, but the development highlights process-control needs as memory manufacturers add structural complexity.