Hanmi targets 2027 launch for wide thermocompression bonder

Hanmi Semiconductor presented several packaging systems at the 2026 SEDEX exhibition. The lineup included the TC Bonder 4 for HBM4 production and a Wide TC Bonder that the company is targeting for launch in 2027. Hanmi also introduced five 2.5D packaging systems designed for larger AI-chip packages. The announcement reflects ongoing investment in packaging tools for memory and AI devices, but gives no production-volume or customer details.