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HBM · Oct 15, 2026

Micron Opens Second Taiwan Advanced Packaging Site for HBM

Micron has opened its second advanced assembly and test facility in Taiwan, expanding packaging and testing capacity for high-bandwidth memory amid growing AI demand.

Price impact: 0Direction: unclearSource: DigiTimes Daily

Micron Technology opened its AATT2 facility in Taichung on October 15. The new site expands the company's HBM packaging and testing capacity. The source does not provide output volume or a date when additional capacity will become available.

Micron TechnologyHBMadvanced packaging
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