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Manufacturing · Oct 15, 2026

TSMC and GlobalFoundries Set Up U.S. Interposer Supply for CoWoS

A five-year, $2 billion manufacturing agreement is intended to add U.S.-based silicon interposer supply for TSMC's CoWoS packaging ecosystem. The capacity is aimed at growing AI and high-performance computing demand, including systems that use HBM.

Price impact: 1Direction: neutralSource: DigiTimes Daily

GlobalFoundries and TSMC have agreed to establish a U.S. source of silicon interposers for TSMC's CoWoS advanced-packaging platform. The reported agreement spans five years and $2 billion. More interposer capacity could ease one part of the packaging supply chain for AI and high-performance computing products, but the source does not specify output volumes or a direct change in HBM availability.

TSMCGlobalFoundriesHBMCoWoSsilicon interposersadvanced packaging
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