Microsoft Maia 300 pairs 288GB of HBM4 with 18TB/s bandwidth

StorageReview reports that Maia 300 combines a TSMC N2P compute die with eight HBM4 stacks providing 288GB and 18TB/s of bandwidth, alongside four DDR memory tiles. The article lists a 950W TDP per accelerator and says a rack holds 96 units. These figures underline the high memory content of AI infrastructure, although the report gives no order volumes or supplier allocation from which to estimate market demand.