Microsoft Maia 300 pairs 288GB of HBM4 with DDR memory tiles

TechPowerUp reports Microsoft's Maia 300 design combines a compute die and two I/O dies with four DDR RDIMM memory tiles and 288GB of HBM4 across eight stacks. The article lists HBM4 bandwidth at 18TB/s and a maximum SoC power rating of 950W. Microsoft is positioning the processor for Azure AI workloads. The configuration illustrates the memory content of data-center accelerators, but the report provides no production-volume or procurement figures.