GlobalFoundries to make CoWoS silicon interposers under five-year TSMC deal

GlobalFoundries and TSMC have signed a five-year manufacturing agreement worth $2 billion for silicon interposers used in TSMC's CoWoS-S packaging ecosystem. GlobalFoundries plans to expand its Malta, New York facility, with volume production scheduled to ramp in the first half of 2028. The interposers provide dense connections between compute chiplets and HBM stacks in AI and high-performance computing packages. The companies have not disclosed the planned output capacity.