SEMIFIVE to develop Mobilint robotics AI chip with LPDDR6 and PCIe Gen6

SEMIFIVE has signed a turnkey development agreement with Mobilint for an AI chip aimed at robotics, according to the companies' announcement. The project is presented as part of South Korea's K-On-Device AI Semiconductor program. Its stated interface set includes LPDDR6, PCIe Gen6 and UCIe-S, connecting the design to emerging memory and chiplet technologies. The announcement describes a development contract; it does not provide shipment timing, production volumes or customer deployments.