Nanya wins approval for 3D packaging and test plant aimed at AI memory demand

Nanya Technology has received approval from Taiwan's National Science and Technology Council park review committee to establish a 3D wafer packaging and testing plant in Pingtung Science Park, according to DigiTimes. The company says the project is intended to serve demand for high-performance, high-bandwidth memory applications, while some customers have begun trial production on specification-based designs. The report does not provide a construction schedule, investment amount or production capacity, and the planned facility should not be confused with an already operating HBM line.