SK hynix reportedly resumes DDR packaging work with Winpac

DigiTimes Daily reports that SK hynix has resumed outsourcing some DDR4 and DDR5 packaging to Winpac. The report says the supplier relationship had ended in 2023 and that renewed work involves flip-chip packaging. It attributes the move to SK hynix's greater use of external assembly and test partners. The supplied excerpt gives no order volume, duration or output target, so the report indicates a sourcing change without quantifying its effect on available DRAM supply.