SK hynix displays HBM4 and SOCAMM2 alongside NVIDIA's Vera Rubin

SK hynix's newsroom describes a September 23 presentation at TSMC's OIP conference in Santa Clara. Its exhibition included a Vera Rubin superchip with 36GB, 12-layer HBM4 and a 96GB SOCAMM2 module. Nearby displays featured 48GB HBM4E with 12 layers, 48GB HBM4 with 16 layers, 36GB HBM3E with 12 layers and a 192GB SOCAMM2 unit. The company explained the separate roles of GPU-adjacent high-bandwidth memory and low-power DRAM serving the CPU. The showcase provides a view of its AI memory portfolio and collaboration with TSMC; the supplied account does not give commercial shipment volumes or contract prices.