HBM base-die sourcing broadens beyond a single foundry model

The logic die at the base of an HBM stack is becoming a new point of competition among foundries and memory makers, according to DigiTimes Daily. The report says Samsung is pairing its own foundry with TSMC for custom base dies, while Micron has confirmed TSMC will make its next-generation base die. It also notes that SK hynix has reportedly considered Intel alongside TSMC for future HBM base-die manufacturing. These different sourcing paths suggest memory makers are looking for flexibility as demand grows for advanced HBM integration. The arrangements are at different stages and do not imply that a second source will necessarily lower costs. The shift matters because base-die availability, qualification, and pricing can influence the speed at which HBM suppliers expand output for AI accelerators.