SK hynix reportedly evaluates Intel as a second HBM base-die source

SK hynix is reportedly evaluating Intel as an additional manufacturing source for HBM base dies starting with the HBM4E generation, according to DigiTimes Daily. The report says the move could reduce the memory maker's reliance on TSMC and improve supply flexibility. Base dies are a key part of the HBM stack, connecting memory layers and supporting integration with accelerators. Adding another manufacturing option could help SK hynix manage supply constraints and negotiate costs as demand for advanced HBM grows. The report remains preliminary and does not confirm a contract, production allocation, price, or schedule. The source also notes that Intel may not have a clear price advantage over TSMC. The development should therefore be viewed as a potential supply-chain diversification step rather than a completed sourcing change.