Samsung and ASML Expand High-NA EUV Collaboration for Next-Generation Manufacturing

Samsung Electronics and ASML have announced an expanded strategic partnership centered on High-NA EUV lithography and advanced semiconductor manufacturing technologies. The companies say the work is intended to accelerate the development and deployment of next-generation capabilities. For Samsung, deeper cooperation around leading-edge lithography is relevant to its broader semiconductor roadmap, which spans both logic and memory technologies. High-NA EUV is a potential enabler for continued process scaling where patterning complexity and precision become more demanding. The supplied announcement does not identify joint-development milestones, fab locations, equipment volumes, investment amounts, or memory-product deployment dates. It is a strategic manufacturing signal rather than a confirmed change to Samsung's DRAM or HBM output.