Samsung Foundry is reportedly allocating a substantial share of its 4 nm manufacturing capacity to HBM4 base dies, according to TechPowerUp's report on Korean media coverage. The report says roughly half of the foundry's SF4 capacity is being directed to this work. HBM4 base dies can incorporate logic such as memory controllers and PHYs, allowing customers to move some functions closer to the memory stack. The report links the allocation to rising interest from ASIC customers and to the next HBM4 and HBM4E generations. The supplied material does not identify the underlying Korean-media source, exact capacity figures, confirmed customer orders, or production timing. It should therefore be read as a reported capacity-allocation signal, not a confirmed Samsung production forecast.
HBM · Sep 7, 2026
Samsung Foundry Reportedly Dedicates Half of Its 4 nm Capacity to HBM4 Base Dies
TechPowerUp reports, citing Korean media, that Samsung Foundry is allocating about half of its 4 nm capacity to HBM4 base-die production as demand grows for customized logic in HBM packages.
Price impact: 3Direction: upSource: TechPowerUp News
SamsungHBM4HBM4EHBM base die4 nm foundry
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