Leading DRAM Makers Point to 3D Stacking Beyond Today's HBM

Executives from the three largest DRAM suppliers used Semicon Taiwan 2026 to describe a transition beyond conventional 2.5D HBM packaging. DigiTimes reports that Samsung, SK hynix and Micron see 3D vertical stacking as a route to shorter data paths and lower transmission power. Moving to wafer-level bonding could improve AI-memory efficiency, while raising manufacturing complexity and capital requirements.