Samsung Maps a Path From Smarter HBM Base Dies to Stacked Compute

Samsung outlined a long-range HBM architecture plan at Hot Chips 2026. The concept begins with more capable logic in the HBM base die, advances toward additional in-memory functions and ultimately envisions DRAM stacked directly on processor logic. These designs could reduce data movement and improve AI-system efficiency, but they also increase packaging, thermal and manufacturing complexity before commercial deployment.