Price impact: 3Direction: downSource: SK hynix Newsroom
SK hynix has broken ground on an advanced packaging facility in West Lafayette, Indiana, backed by an investment of more than $4 billion. The company says the site will support next-generation HBM production in the United States and is targeting the second half of 2029 for volume output. The project expands geographic diversity for AI-memory packaging, although its supply effect is several years away.
SK hynixHBMadvanced packagingAI memory
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