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HBM · Sep 2, 2026

SK hynix Starts Work on $4 Billion Indiana HBM Packaging Hub

The Indiana project is intended to establish a U.S. production base for next-generation high-bandwidth memory, with mass production planned for the second half of 2029.

Price impact: 3Direction: downSource: SK hynix Newsroom

SK hynix has broken ground on an advanced packaging facility in West Lafayette, Indiana, backed by an investment of more than $4 billion. The company says the site will support next-generation HBM production in the United States and is targeting the second half of 2029 for volume output. The project expands geographic diversity for AI-memory packaging, although its supply effect is several years away.

SK hynixHBMadvanced packagingAI memory
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