AI Substrate Demand Pushes Samsung and LG Innotek Lines Near Full Use

Advanced packaging substrates are showing another sign of tight utilization. DigiTimes reports that Samsung Electro-Mechanics and LG Innotek operated semiconductor package substrate lines near full capacity in the first half of 2026, with demand coming from AI accelerators, server CPUs, memory, and data center networking. For RamTrend, this is not a pure DRAM or NAND pricing article, but it is relevant to the AI memory supply chain. HBM and high-end server platforms depend on complex packaging ecosystems, and substrate tightness can become a bottleneck around advanced compute and memory modules. The price read is mildly upward because the report points to high utilization in a supporting supply chain. The article does not say memory output is constrained directly, so the impact should remain limited and indirect.