Taiwan's OSAT sector is accelerating overseas expansion as AI demand increases the need for packaging and testing capacity. DigiTimes identifies ASE, SPIL, KYEC, Greatek, and Tong Hsing among the companies building resilience outside their home market and China. For memory markets, the read-through is strongest around HBM. AI accelerator output depends on packaging, test, and integration capacity, not just DRAM wafer availability. More geographically distributed OSAT capacity can reduce execution risk for AI hardware supply chains, while also signaling that demand for advanced packages remains strong.
AI Infrastructure · Aug 10, 2026
Taiwan OSATs Add Overseas Capacity as AI Packaging Demand Rises
Taiwanese packaging and testing providers are expanding outside China and Taiwan as AI demand lifts the need for more resilient OSAT capacity.
Price impact: 2Direction: upSource: DigiTimes Daily
ASESPILKYECGreatekTong HsingOSATSemiconductor packagingSemiconductor testingHBMAI accelerators
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