Rapidus AI Foundry Plan Ties 2nm Logic to HBM Packaging

DigiTimes reports that Rapidus is building its AI foundry model around more than front-end wafer processing. The Japanese chipmaker is connecting design enablement, chiplet integration, packaging, testing, and manufacturing data through its IIM-1 approach, with HBM and advanced packaging included in the strategic scope. For RamTrend, the point is that HBM supply increasingly depends on full-system integration. Foundries competing for AI customers need logic, packaging, and memory attach capability to line up together. Rapidus is still an emerging player, so this is not an immediate supply change, but it shows how advanced packaging has become part of AI memory competition.