TSMC reportedly has a large inventory of Apple processors awaiting final packaging because the required DRAM has not arrived from Apple's memory suppliers. The issue centers on package-on-package integration, where LPDDR5X is placed with the application processor rather than installed elsewhere on the board. That makes memory availability a direct gating item for finished chip supply. The report highlights how tight mobile DRAM availability can ripple beyond memory buyers and affect semiconductor packaging schedules. Apple is said to rely mainly on Micron for LPDDR5X while also sourcing from SK hynix and Samsung. For the memory market, the signal is that leading smartphone demand is competing for constrained high-end DRAM at a sensitive point in the product cycle. That supports the broader view that mobile DRAM pricing power remains with suppliers until allocations loosen.
Mobile Memory · Aug 7, 2026
Apple DRAM Delays Reportedly Leave TSMC Holding Unfinished iPhone Chip Inventory
A reported DRAM supply gap for Apple's next iPhone cycle is now showing up at the packaging stage, with TSMC said to be waiting on memory deliveries.
Price impact: 6Direction: upSource: TechPowerUp News
AppleTSMCMicronSamsungSK hynixDRAMLPDDR5Xpackage-on-package
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