SK hynix presents a broader AI memory stack at FMS 2026

The main signal is strategic breadth. SK hynix is positioning tiered memory as AI models outgrow one memory class, with HBM for bandwidth, CXL for capacity expansion, HBF as a flash-based near-compute tier, and products such as SOCAMM2 and DDR5 RDIMM for server designs. This supports the view that AI memory demand is spreading across multiple form factors. It also reinforces that HBM leadership is only one part of the AI infrastructure memory stack.