Samsung Schedules Onyang HBM Packaging Expansion for 2026 Groundbreaking

DigiTimes reports that Samsung Electronics intends to break ground in October 2026 on an expansion of its Onyang semiconductor packaging facility in South Korea. The project is valued at KRW 1.3 trillion, roughly US$884 million, and is aimed at supporting high-bandwidth memory mass production from May 2029. For RamTrend, the message is straightforward: HBM competition is not only about wafer capacity, but also about the packaging infrastructure needed to bring advanced memory to market. Because the planned production start is several years out, the pricing effect is more relevant to long-term supply expectations than to current spot conditions.