Hanmi Capacity Push Highlights a Potential HBM Packaging Bottleneck for 2027

Hanmi Semiconductor is expanding production of the bonding tools used in high-bandwidth memory manufacturing and is warning that demand may outpace supply from 2027. That matters because HBM output depends not only on memory die supply, but also on specialized packaging and assembly equipment. For RamTrend, the signal is that continued AI infrastructure spending could keep pressure on HBM capacity planning at companies such as SK hynix and Micron. If equipment lead times stretch, HBM supply growth could slow and support firmer pricing across the high-end memory segment.