Asahi Kasei adds Taiwan capacity for advanced packaging materials

The EE Times Asia item says Asahi Kasei completed a new slitting facility for SUNFORT dry film photoresist at its Tainan site, with commercial operation planned for July 2026. The expansion is tied to increasing demand for advanced semiconductor packaging and Taiwan's concentration of packaging companies. For RamTrend, this is an indirect supply-chain signal. Advanced packaging capacity and materials availability matter for AI chips and memory-adjacent package integration, but the compact payload does not cite HBM, DRAM, NAND, or a direct memory component. The price impact should therefore be treated as neutral unless later reporting links the added capacity to specific memory packaging bottlenecks.