SK hynix Warns Memory Supply Tightness Could Peak in 2027 and Extend to 2030

SK hynix chief executive Kwak Noh-jung said the memory industry could face its most severe supply pressure in 2027, with demand continuing to exceed available capacity beyond 2030. The comments came shortly after the company raised fresh capital through its Nasdaq listing, reinforcing the message that long-duration investment in advanced memory production remains necessary. The supply argument centers on HBM for AI accelerators. Compared with mainstream DDR5, HBM requires more complex manufacturing and packaging and consumes more wafer capacity, which can limit how much conventional DRAM the industry can produce at the same time. That dynamic has already supported multi-year supply agreements and elevated pricing across parts of the memory market. For RamTrend readers, the key takeaway is that any sustained shift toward HBM-heavy output can keep DRAM and related memory prices firm even if quarterly gains cool from recent peaks. Still, this remains a supplier outlook, so future pricing will depend on how quickly new capacity comes online and whether AI demand stays at current levels.