Hanmi targets CoWoS packaging demand as ASE expands capacity

DigiTimes reports that Hanmi Semiconductor is broadening its equipment focus from high-bandwidth-memory tools into advanced chip packaging. At the same time, ASE is expanding capacity to address demand connected to TSMC's advanced packaging ecosystem. The relevance for RamTrend is the packaging bottleneck around AI accelerators. HBM demand depends not only on stacked DRAM output, but also on the packaging capacity and tools needed to integrate memory close to processors. If OSAT capacity and packaging equipment availability improve, it can help relieve one constraint in the AI memory supply chain. This is not a direct HBM price report, but it is a meaningful infrastructure signal. More investment around CoWoS-related packaging can support higher HBM throughput over time, while also showing that suppliers and equipment makers expect advanced packaging demand to stay strong into the second half of 2026 and beyond.