SK hynix has outlined a large long-term investment plan for Cheongju, South Korea, including a new NAND fabrication facility and additional advanced packaging capacity. According to the company, roughly KRW 80 trillion is aimed at the M17 NAND fab and about KRW 20 trillion at the P&T7 packaging facility, with packaging targeted for completion by the end of 2027 and fab operations expected in the first half of 2029. The company links the expansion to rising AI demand for enterprise SSDs, NAND flash, HBM, and server DRAM. For RamTrend, the key takeaway is that AI infrastructure growth is broadening demand beyond accelerator memory alone and is influencing upstream storage and packaging investment decisions. If demand continues to outpace supply as SK hynix suggests, the investment supports a constructive pricing backdrop for parts of the NAND and enterprise memory market over the medium term, though new volume from this project is still years away.
NAND Flash · Jul 6, 2026
SK hynix Plans Major Cheongju Expansion for NAND and Packaging Capacity
SK hynix says it will invest heavily in Cheongju to expand NAND manufacturing and advanced packaging as AI demand lifts pressure across storage and memory markets. The plan matters because it ties future supply growth not only to HBM, but also to enterprise SSDs, NAND flash, and server DRAM demand driven by larger AI infrastructure builds.
Price impact: 3Direction: upSource: StorageReview
SK hynixSamsungNANDNAND FlashHBMDRAMserver DRAMenterprise SSDadvanced packaging
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