US AI Chip Output Grows, but HBM Packaging Still Depends on Asia

Recent updates from Nvidia and Intel point to real progress in American wafer fabrication and system assembly, including Blackwell wafer output in Arizona and new AI hardware assembly projects in Texas. But the supply chain for finished accelerator products is still incomplete. Blackwell dies produced in Arizona are still sent to Taiwan for advanced packaging, and current HBM production remains concentrated in SK hynix and Samsung facilities in South Korea and Micron sites in Taiwan and Japan. That gap matters for the memory market because advanced packaging and HBM integration are essential to high-end AI accelerators. New U.S. projects from Amkor, TSMC, and SK hynix could reduce that dependence, but most of the planned capacity is not expected to start production until 2028 or later. Until then, AI server supply will continue to rely on overseas packaging and memory ecosystems, which keeps logistics risk elevated and limits any near-term shift in HBM pricing power.