SK hynix Maps Major NAND And HBM Spending

Tom's Hardware reports that SK hynix is planning a very large domestic investment program, with the clearest near-term detail centered on its Cheongju campus. The reported plan includes a new 3D NAND fab and an added packaging and test facility for HBM back-end work. The timing matters for RamTrend because new wafer and packaging capacity does not arrive immediately. If construction begins next year as described, the added NAND and HBM infrastructure is more relevant to supply expectations later in the decade than to short-term spot pricing. Still, the spending direction confirms that SK hynix is preparing for sustained demand across storage and AI memory.