AI Demand Keeps CoWoS And HBM Supply Tight

The DIGITIMES payload says 2026 AI demand is spreading into ASICs, networking chips, PMICs, and other peripheral ICs. That is tightening both mature 8-inch production and advanced 12-inch nodes while giving foundries more pricing power. For RamTrend, the memory-specific signal is the continued shortage in HBM capacity alongside CoWoS packaging. HBM supply is closely tied to advanced packaging availability, so persistent bottlenecks can limit AI accelerator output and keep premium memory pricing firm.