Hanmi Broadens AI Packaging Push With New Bonder Beyond Core HBM Tools

Hanmi Semiconductor has launched FC Bonder 3.5, a flip-chip bonding tool intended for AI system semiconductor packaging. According to the source, the company is using the product to expand its advanced packaging business beyond thermal-compression bonders tied to high-bandwidth memory and to serve foundry and OSAT customers more broadly. For the memory market, the significance is indirect but real: stronger investment in packaging equipment can support the infrastructure needed to integrate HBM and other advanced components into AI systems, helping relieve backend bottlenecks over time.