ASE Says AI Demand Is Absorbing Packaging Capacity Into 2030

This is relevant to AI memory because packaging capacity is a key bottleneck around advanced accelerators and high-bandwidth memory integration. The compact source does not specifically mention HBM, but strong AI packaging demand through 2030 is an important supply-chain signal for systems that depend on advanced assembly. The pricing impact is indirect but positive for tightness. If packaging capacity remains constrained, it can limit the pace at which AI compute and memory packages reach the market, reinforcing allocation pressure across advanced components. The source does not provide product-level capacity, customer mix, or HBM-specific figures, so the conclusion should remain broad.