SK hynix Prepares 375-Layer NAND as Capacity Expansion Continues

SK hynix is moving toward mass production of 375-layer 3D NAND flash by year-end, according to the available DigiTimes item. The same report says the company is also advancing broader capacity expansion plans and could pursue a U.S. listing as early as August. The technology step matters because higher-layer NAND generally supports denser flash products and can improve cost structure over time. The capacity language is also important for price watchers: if demand does not absorb the added output, the buildout could add medium-term pressure to NAND pricing. The compact source does not provide wafer volumes, fab schedules, or customer commitments, so the pricing signal should be treated as directional rather than immediate.