Google TPU Packaging Order Points to More HBM Integration Work at Intel

The report is primarily about Google's future TPU supply chain and Intel's advanced packaging role, but the HBM detail makes it relevant for RamTrend. If Intel's EMIB packaging proves viable for large accelerator programs, it could become another channel for integrating HBM into high-volume AI chips. For the memory market, the signal is constructive rather than immediate. A 2028 packaging order does not change current HBM supply, but it reinforces the idea that hyperscale AI processors will continue to require advanced packaging flows that can attach high-bandwidth memory at scale. SK hynix testing around HBM integration also keeps memory vendors tied closely to packaging-capacity decisions, not just wafer capacity.