HBM Inspection Complexity Keeps Reliability in Focus

The article explains that HBM's stacked DRAM architecture, through-silicon vias and die-to-die interconnects create inspection challenges that traditional 2D X-ray tools cannot fully address. It highlights 3D X-ray computed tomography as a non-destructive method for checking TSV integrity, micro-bumps, die alignment and voids. For RamTrend, the relevance is manufacturing quality rather than immediate pricing: better inspection can support yield learning and reliability as HBM becomes more central to AI and high-performance computing systems.