LG Innotek Samples EMIB Substrates to SK hynix

DigiTimes, citing ZDNet Korea, reports that LG Innotek is pursuing a role in substrates used for Intel's EMIB advanced-packaging technology. The compact payload says the company has sent early samples to SK hynix as it pushes into higher-end semiconductor substrate markets. The memory-market connection is indirect but relevant. EMIB-style packaging is part of the broader advanced-packaging ecosystem around high-performance accelerators, where memory suppliers such as SK hynix must coordinate with substrate and packaging partners. The report does not say that LG Innotek has won supply, entered volume production, or tied the samples to a specific HBM program. That keeps the price impact limited.