SK hynix and TSMC Put HBM4 Base Dies in Focus

DigiTimes reports that SK Group's Chey Tae-won and TSMC's C.C. Wei held talks in Taiwan on June 3. The discussion centered on future collaboration between SK hynix and TSMC across HBM4 base dies, advanced logic processes, and customized AI memory. For RamTrend, this is a strong HBM roadmap signal. HBM4 depends on tight coordination between memory suppliers and logic-foundry partners because the base die and packaging stack are central to bandwidth, power, and accelerator integration. The payload does not include production timing, capacity allocation, customer names, or pricing terms. Even so, the focus on HBM4 suggests that AI memory supply planning is moving further upstream into foundry and packaging decisions.