SK hynix Uses COMPUTEX 2026 to Highlight HBM4, HBM4E and AI Memory Roadmap

At COMPUTEX 2026 in Taipei, SK hynix centered its booth around AI-focused memory and storage products, with the strongest attention on its high-bandwidth memory lineup. The company displayed 12-layer 36GB HBM3E, 16-layer 48GB HBM4 and 12-layer 48GB HBM4E alongside server DRAM products such as a 256GB 3DS RDIMM, a 64GB RDIMM built on its sixth-generation 1c 10nm-class process, and a 128GB DDR5 MRDIMM aimed at AI workloads. The portfolio also included enterprise SSDs and several forward-looking products tied to AI infrastructure, including High Bandwidth Flash, ZUFS 4.1, LPCAMM2 and a CXL-based CMM-DDR5 concept. For RamTrend, the announcement matters less as an immediate supply event and more as a signal of where vendor investment and customer attention are concentrating: high-bandwidth DRAM, higher-capacity server memory, and storage products designed for AI systems. The presentation supports the view that AI-driven demand remains a major force shaping premium memory product development, though the article does not provide new pricing, shipment or capacity guidance.